MediaTek expands market in the United States and will debut on high-end mobile phones in 2024
Jakarta (MidLand) – Semiconductor company MediaTek has announced its plans to expand market coverage by debuting high-end smartphones in the United States in 2024.
This news came from one of the participants at the MediaTek Analyst Day event who uploaded this information to X via the @nirave account.
Of course, this information is interesting news considering that in the United States almost all gadgets on the market are dominated by chip which is made by Qualcomm, while the rest is controlled by Samsung’s Exynos or Google’s Tensor.
The interesting thing is that the choice of debut was not made in the segment of classy devices basic level OR mid range. MediaTek is actually targeting the mobile or high-end market high end.
Read also: MediaTek enters the mid-range market with Dimensity 6300
Latest news from #MediaTekAnalystDay: the first @MediaTek Smartphones from the premium segment will be launched in the US later this year. pic.twitter.com/oG1FgxA5yO
— Nirave Nirav (@nirave) May 2, 2024
While this news doesn’t provide any details yet, it’s quite interesting to follow.
It is not yet certain which device from the MediaTek-based cellphone manufacturer will be introduced in the United States, but it is very likely that the cellphone will come from Vivo.
Read also: MediaTek has released the new Helio G91 chipset
In 2024, Vivo is expected to launch Vivo X100s and X100s Pro, which will be the first mobile phones equipped with chipsets Size 9300 Plus.
Chip which is the little brother of the Dimensity 9300, will be introduced on May 7, 2024 by MediaTek.
Serious chip Size 9300 is chip top class from MediaTek which is currently on the market and will be introduced in November 2023.
Vivo X100 and X100 Pro are the first phones to feature it.
Read also: MediaTek designs its newest chipset to optimize Gemini Nano
However, it could also be that the mobile comes from Oppo. This is because in October 2024 MediaTek will introduce it chip the latest generation of high-end Dimensity 9400.
Chip it is expected to be built on a 3nm architecture with ARM’s next-generation Cortex-X5 CPU cores.
Chip It will also power Oppo’s next flagship phone, which appears to be the Oppo Find X8.
All of this is just a projection and it remains to be seen whether any of these devices will hit the US market in 2024, Gizmochina reported on Friday.
Read also: Advantages of the Dimensity 8300 ultra chipset present on the POCO X6 Pro 5G
Read also: MediaTek releases Dimensity 8300 that offers power saving for 5G mobile phones
Translator: Livia Kristianti
Publisher: Siti Zulaikha
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